ImageMaster® PRO 5 Wafer - MTF Measurement of Wafer Level Optics
The Image Master® PRO 5 Wafer has been designed to meet the requirements of quality assurance within the production of the new generation of wafer level objective lenses i.e. for mobile phone/digital cameras or automotive sensors that are manufactured in large quantities on wafers. Optical wafers of any size up to a diameter of 8 inch (200 mm) and thousands of miniature lenses or objectives can be tested and qualified in one fully automatic test run at high speed. The ImageMaster® PRO 5 Wafer instrument is fully automated and prepared for measurement of lenses on circular wafers or single lenses that are arranged in a tray.
Key Features:
- Fastest measurement (less than 1 sec. per lens) of MTF in fixed image plane position
- Highest FFL accuracy for spacer thickness determination
- Tilt correction function (bow compensation)
- Measurement traceable to international standards
- Wafer bow measurement
- Max wafer diameter up to 8 inch (200 mm)
(on request 12inch 300mm) - Quick, software-controlled wafer alignment
- Data processing for next production steps
- Operation status light indicator
- Easy loading due to kinematic mount and wafer rotation and shift adjustment tool
- An assortment of pass and fail criteria allows use of the most suitable criterion for each type of lens
- Cleanroom compatibility ISO 5
Applications
- MTF on and off axis
- Effective Focal Length (EFL)
- Flange Focal Length (FFL)
- Field curvature
- Depth of focus
- Chromatic aberrations
- Astigmatism
- Relative distortion
MTF-Pro Software for the MTF Measurement of Optical Wafers
The recognized ImageMaster® PRO software, called MTF-Pro, has been further improved. It features increased speed, advanced performance and clearly displayed test results. The optimized MTF algorithms are the result of the continuous improvement and TRIOPTICS’ years of experience in the field of MTF measurement. For wafer optics measurement the software provides a special tool for the alignment of the wafer.
Advantages
- Recognition of wafer marks and control of wafer alignment
- Generation of a testing pattern depending on the wafer specification
- Integration of an optical sensor for wafer bow measurement and highest accuracy of flange focal length (FFL)
- Mapping of the wafer in order to determine the dimensions of the spacers
- Bow compensation scan algorithms
- Generation of appropriate masks for wafer testing
ImageMaster® PRO 5 Wafer |
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Optical set up | Infinite-finite conjugates |
Max. spatial frequency | 400 lp /mm |
Accuracy MTF on-axis | 1,5 % MTF |
Accuracy MTF off-axis | 2,5 % MTF |
Accuracy EFL (Effective Focal Length) | 5 µm |
Accuracy FFL (Flange Focal Length) | 4 µm (by distance sensor) |
Minimum measurement time | 1.0 sec / sample |
Average measurement time | 2.5 sec / sample |
Dimensions (height x width x depth) | 1350 mm x 1330 mm x 675 mm |
Weight | 210 kg |
Sample holder | Wafer tray |
Cleanroom class FS 209 / ISO14644-1 | 100 / ISO 5 |
Upgrades and Accessories for ImageMaster® PRO 5 Wafer
- Upgrades for field extension: Upgrade from ImageMaster® PRO 5 Wafer with 9 cameras to ImageMaster® PRO 5 Wafer with 13, 17 or 25 cameras
- Software upgrades to ImageMaster® PRO 5 Ultra
- Upgrades for ImageMaster® PRO Wafer to ImageMaster® PRO 5 Wafer
- Variety of trays for 4”, 6”, 8” and 12” wafers
- Additional reticles in kinematic mount
- Chromatic sensor for FFL and wafer bow measurement
- WaferCheck software package
- Extended NIR chromatic sensor
- Master lenses FFL, EFL, MTF on-axis